SP8M3
Transistors
Switching
SP8M3
zFeatures
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) small and Surface Mount Package (SOP8).
zApplication
Power switching, DC / DC converter.
zAbsolute maximum ratings (Ta=25°C)
ParameterSymbol
V
DSS
V
GSS
I
D
I
DP
I
S
I
SP
P
D
Tch
Tstg
Limits
NchannelPchannel
30
?30
20
?20
±5.0
±4.5
±20
±18
1.6
?1.6
20
?18
2
150
?55 to +150
zExternal dimensions (Unit : mm)
SOP8
5.0±0.2
(
5
)
(
8
)
6.
.
0
±
0
.
3
3
9
±
0
.
1
5
1
.
5
±
0
.
1
0
.
1
5
1.27
0.4±0.1
0.1
Each lead has same dimensions
M
a
x
.
1
.
7
5
0
.
5
±
0
.
1
(
1
)
(
4
)
0.2±0.1
zEquivalent circuit
Unit
V
V
A
A
A
A
W
°C
°C
(8)(7)
(6)(5)
(8)(7)(6)(5)
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Total power dissipation
Channel temperature
Storage temperature
?1 Pw≤10μs, Duty cycle≤1%
?2 MOUNTED ON A CERAMIC BOARD.
Continuous
Puld
Continuous
Puld
?1
?1
?2
?2
SP8M3
Transistors
N-ch
zElectrical characteristics (Ta=25°C)
ParameterSymbol
Min.Typ.Max.Conditions
??10μAV
30??VI=1mA, V=0V
??1IμAV=30V, V=0V
1.0?2.5VV=10V, I=1mA
?3651I
?5273m?I=5.0A, V=4.5VR
?5882I
3.0??SI=5.0A, V=10V
?230?Input capacitancepFV=10V
?80Output capacitance
?
?6t
?8Vt
?22Rt
?R=10?
?3.95.5nCV 15VQ
?1.1Q
?1.4?nCI=5.0AQ
50Rever transfer capacitanceC
5t
?pFV=0V
?pFf=1MHz
?ns
?ns
?ns
?ns
?nCV=5V
I
GSS
Gate-source leakage
Drain-source breakdown voltageV
(BR) DSSDGS
DSSDSGS
Zero gate voltage drain current
V
GS (th)DSD
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Turn-on delay time
Ri time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
?Puld
Unit
GSDS
=20V, V=0V
DGS
=5.0A, V=10V
DGSDS (on)
DGS
=5.0A, V=4V
DDSfs
DSiss
GS
I=2.5A, V 15V
DDD
GS
=10V
Ld (off)
=6.0?
Gf
DDg
GS
Dgd
?
?
?
?
Y
C
C
oss
rss
d (on)
r
gs
?
?
?
?
?
?
?
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)
ParameterSymbol
Forward voltage
?Puld
V??1.2VI=6.4A, V=0V
SDSGS
Min.Typ.Max.Conditions
Unit
?
Rev.A 2/5
SP8M3
Transistors
P-ch
zElectrical characteristics (Ta=25°C)
ParameterSymbol
Min.Typ.Max.Conditions
??10?μA
???30V
??1I?μA
??2.5?1.0VV
4056?
5780?m?
6590?
??3.5S
850??Input capacitancepFV= ?10V
190?Output capacitanceV=0V
120Rever transfer capacitanceC
10t?
25t?V
60t?
25t
8.5Q?
2.5Q?
3.0?Q?nCI
?pF
?pF
?ns
?ns
?ns
?ns
?nC
?nC
I
GSS
Gate-source leakageV= ?20V, V=0V
Drain-source breakdown voltageVI= ?1mA, V=0V
(BR) DSS
DSS
Zero gate voltage drain currentV=?30V, V=0V
V
GS (th)
Gate threshold voltage= ?10V, I= ?1mA
Static drain-source on-state
R
DS (on)
resistance
Y
fs
Forward transfer admittance= ?2.5A, V= ?10V
C
issDS
C
oss
rss
?f=1MHz
Turn-on delay time
d (on)
Ri time
r
Turn-off delay time
d (off)
Fall time
f
?
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
?Puld
Unit
GSDS
DGS
DSGS
DSD
I= ?4.5A, V= ?10V
DGS
I= ?2.5A, V= ?4.5V
DGS
I
DGS
= ?2.5A, V= ?4.0V
I
DDS
GS
I= ?2.5A, V ?15V
DDD
GS
= ?10V
R=6.0?
L
R=10?
G
V ?15V
DD
V= ?5V
GS
D
= ?4.5A
?
?
?
?
?
?
?
?
?
?
?
zBody diode characteristics (Source-Drain Characteristics) (Ta=25°C)
ParameterSymbol
Forward voltage
?Puld
V???1.2VI= ?1.6A, V=0V
SDSGS
Min.Typ.Max.Conditions
Unit
?
Rev.A 3/5
SP8M3
Transistors
N-ch
zElectrical characteristic curves
G
A
T
E
-
S
O
U
R
C
E
V
O
L
T
A
G
E
:
V
G
S
(
V
)
1000
Ta=25°C
f=1MHz
V
GS
=0V
10000
S
W
I
T
C
H
I
N
G
T
I
M
E
:
t
(
n
s
)
C
A
P
A
C
I
T
A
N
C
E
:
C
(
p
F
)
1000
t
f
Ta=25°C
V=15V
DD
V
GS
=10V
R=10?
G
Puld
10
Ta=25°C
9
V=15V
DD
I=5A
D
8
R=10?
G
7
Puld
6
5
4
3
2
1
0
012345678
C
iss
100
C
oss
C
rss
100
t
d (off)
10
t
r
t
d (on)
10
0.010.1110100
1
0.010.1110
DRAIN-SOURCE VOLTAGE : V
DS
(V)
DRAIN CURRENT : I
D
(A)
TOTAL GATE CHARGE : Qg(nC)
Fig.1 Typical Capacitance
vs. Drain-Source Voltage
Fig.2 Switching Characteristics
Fig.3 Dynamic Input Characteristics
V=10V
DS
Puld
Ta=125°C
Ta=75°C
Ta=25°C
Ta= ?25°C
S
T
A
T
I
C
D
R
A
I
N
-
S
O
U
R
C
E
O
N
-
S
T
A
T
E
R
E
S
I
S
T
A
N
C
EI=5A
:
R
D
S
(
o
n
)
(
m
?
)
D
R
A
I
N
C
U
R
R
E
N
T
:
I
D
(
A
)
10
300
250
200
150
100
50
0
Ta=25°C
Puld
S
O
U
R
C
E
C
U
R
R
E
N
T
:
I
s
(
A
)
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta= ?25°C
V=0V
GS
Puld
1
D
I=2.5A
D
1
0.1
0.1
0.01
0.001
0.00.51.01.52.02.53.03.54.0
0246810121416
0.01
0.00.51.01.5
GATE-SOURCE VOLTAGE : V(V)
GS
GATE-SOURCE VOLTAGE : V(V)
GS
SOURCE-DRAIN VOLTAGE : V
SD
(V)
Fig.4 Typical Transfer Characteristics
Fig.5 Static Drain-Source
On-State Resistance vs.
Gate-Source Voltage
Fig.6 Source Current vs.
Source-Drain Voltage
S
T
A
T
SP8M3
Transistors
P-ch
zElectrical characteristic curves
G
A
T
E
-
S
O
U
R
C
E
V
O
L
T
A
G
E
:
?
V
G
S
(
V
)
10000
Ta=25°C
f=1MHz
V=0V
GS
10000
S
W
I
T
C
H
I
N
G
T
I
M
E
:
t
(
n
s
)
C
A
P
A
C
I
T
A
N
C
E
:
C
(
p
F
)
1000
1000
C
iss
Ta=25°C
V= ?15V
DD
V= ?10V
GS
R
G
=10?
Puld
8
7
6
5
4
3
2
1
0
012345678910
Ta=25°C
V= ?15V
DD
I
D
= ?4.5A
R=10?
G
Puld
t
f
100
t
d (off)
100
C
oss
C
rss
10
t
d (on)
t
r
10
0.010.1110100
1
0.010.1110
DRAIN-SOURCE VOLTAGE : ?V(V)
DS
DRAIN CURRENT : ?I(A)
D
TOTAL GATE CHARGE : Qg(nC)
Fig.1 Typical Capacitance
vs. Drain-Source Voltage
Fig.2 Switching Characteristics
Fig.3 Dynamic Input Characteristics
S
T
A
T
I
C
D
R
A
I
N
-
S
O
U
R
C
E
O
N
-
S
T
A
T
E
R
E
S
I
S
T
A
N
C
E
:
R
D
S
(
o
n
)
(
m
?
)
D
R
A
I
N
C
U
R
R
E
N
T
:
?
I
D
(
A
)
10
V= ?10V
DS
Puld
Ta=125°C
Ta=75°C
Ta=25°C
Ta= ?25°C
200
Ta=25°C
Puld
I=?4.5A
D
I=?2.0A
D
S
O
U
R
C
E
C
U
R
R
E
N
T
:
?
I
S
(
A
)
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta= ?25°C
V=0V
GS
Puld
1
150
1
0.1
100
0.1
0.01
50
0.001
0.00.51.01.52.02.53.03.54.0
0
0246810121416
0.01
0.00.51.01.5
GATE-SOURCE VOLTAGE : ?V(V)
GS
GATE-SOURCE VOLTAGE : ?V(V)
GS
SOURCE-DRAIN VOLTAGE : ?V
SD
(V)
Fig.4 Typical Transfer Characteristics
Fig.5 Static Drain-Source
On-State Resistance vs.
Gate-Source Voltage
Fig.6 Source Current vs.
Source-Drain Voltage
SS
TT
AA
TT
II
CC
DD
RR
AA
II
NN
--
S
O
UU
RR
CC
EE
OO
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual u, therefore, plea request
that specifications to be parately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
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